发明名称 MOLD RELEASE COMPOSITION.
摘要 A mold release composition which comprises 10-95 wt.% of a copolymer of a C1-C20 polyfluoroalkyl ester of acrylic or methacrylic acid with a vinylic compound having a C8-C30 alkyl group and 90-5 wt.% of a silicone. It has a sufficient ability to effect mold release, little transfers to the surface of a molding, and does not adversely affect the fabricability of the surface of a molding.
申请公布号 EP0591545(A1) 申请公布日期 1994.04.13
申请号 EP19930906827 申请日期 1993.03.26
申请人 DAIKIN INDUSTRIES, LTD. 发明人 YAMANA, MASAYUKI, YODOGAWA WORKS OF;TAKUBO, SEIJI, YODOGAWA WORKS OF
分类号 B29C33/62;B29C33/64;C08L33/06;C08L83/04;C09D183/04;(IPC1-7):B29C33/62 主分类号 B29C33/62
代理机构 代理人
主权项
地址