发明名称 |
Via fill compositions. |
摘要 |
<p>A thick film paste especially suitable for via fill applications comprising finely divided particles of conductive metal which is not alloyable with silver selected from the group consisting of Os, Ru, Ir, Rh and mixtures and alloys thereof and optionally a small amount of inorganic binder both dispersed in a liquid organic medium.</p> |
申请公布号 |
EP0591604(A2) |
申请公布日期 |
1994.04.13 |
申请号 |
EP19930103541 |
申请日期 |
1993.03.05 |
申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
HORMADALY, JACOB;MONES, ARTHUR HARVEY |
分类号 |
C01G55/00;H01L23/498;H05K1/03;H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
C01G55/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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