Thermoelectric cooling device for thermoelectric refrigerator and process of fabrication thereof.

摘要

A thermoelectric cooling element series 5 is constructed of heat-absorbing-side electrodes 8 arranged at predetermined intervals, p-type semiconductor layers 10 and n-type semiconductor layers 11 formed on the electrodes, and heatsink-side electrodes 12 connecting the p-type semiconductor layers 10 and the n-type semiconductor layers 11 together. The numerous p-type semiconductor layers 10 and n-type semiconductor layers 11 are arranged in parallel and are electrically connected in series (see FIG. 6) High thermal-conductivity silicone grease layers 17,17 are formed between the thermoelectric cooling element series 5 and the heat absorber 4 and between the thermoelectric cooling element series 5 and a heatsink 6, respectively. <IMAGE>