| 摘要 |
PURPOSE:To automatically and surely remove resin secured to surfaces of a reference pin, used for positioning at the time of pressure-molding a multilayer printed wiring board, by a buff. CONSTITUTION:A device has a disk-shaped buff 1 having a rotary shaft in a horizontal direction, motor 3 for driving the buff 1 rotated, two free rollers 5 horizontally juxtaposed by providing axes parallelly to the rotary shaft of the buff 1 and a pusher 7 for pressing reference pins 4 along the free rollers 5 inserted through a clearance formed by the buff 1 and the free rollers 5. |
