| 摘要 |
An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the composite semiconductor substrate sub-assembly includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the composite semiconductor substrate subassembly, comprising a cover plate with the composite substrate attached thereto, is attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. The composite substrate employed in the present invention offers the advantage of allowing the components to be pre-assembled, tested and repaired prior to final attachment into the molded frame. |
