| 发明名称 |
Method of forming a coated plastic package |
| 摘要 |
The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic, silica or other plastic material is applied over a plastic packaged semiconductor device to seal the package from moisture. |
| 申请公布号 |
US5302553(A) |
申请公布日期 |
1994.04.12 |
| 申请号 |
US19910771720 |
申请日期 |
1991.10.04 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ABBOTT, DONALD C.;FRECHETTE, RAYMOND A. |
| 分类号 |
H01L21/56;H01L23/28;H01L23/29;H01L23/31;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
