| 摘要 |
PURPOSE:To obtain the subject composition giving an epoxy resin laminated board having improved heat-resistance level, prolonged pot-life of prepreg and high latent activity by adding dicyandiamide and a specific imidazole compound to an epoxy resin. CONSTITUTION:The objective composition is produced by compounding (A) an epoxy resin with (B) dicyandiamide and (C) an imidazole compound of formula (R1 and R2 are H, 1-20C alkyl or phenyl; R3 is 1-3C alkyl; (n) is 1 or 2). The component C can be produced e.g. by reacting a bisphenol F epoxy resin or a bisphenol A epoxy resin with 2-methylimidazole, 2-phenylimidazole, 2- ethyl-4-methylimidazole, etc. |
