| 摘要 |
PURPOSE:To polish a wafer finished in its polished surface to high flatness further with uniformity over a total surface. CONSTITUTION:A device is provided with a conveying mechanism 4 wherein an upper surface plate 6 for rotating a top ring through a universal joint is conveyed to run to a polishing position by a linear guide after sucking a wafer W and to a pre-washing mechanism 9 after polishing, to detach the wafer W. A liquid flow path opened to an upper surface is formed in the inside of a lower surface plate, and a polishing cloth is fixed to the upper surface through a foaming resin-made sheet of 0.5 to 3mm thickness having many communication blow holes, to provide a cooling water supply means for circulating cooling water from the outside. A vacuum path opened to a lower surface is formed in the inside of the upper surface plate, to fix a flat plate-shaped ceramics chuck, having many through holes, to the lower surface, and further a washing means of a back pad for holding the wafer W by the back pad is provided. |
