| 摘要 |
PURPOSE:To prevent a die pad or a semiconductor chip from floating or sinking by providing external terminals at the periphery on the circuit forming surface of the semiconductor chip, connecting the circuit forming surface with the die pad, wire bonding inner leads with the external terminals, and shaping a support bar. CONSTITUTION:Circuit forming surface of a semiconductor chip 1 is bonded to a die pad using an insulating film 4 such that the external terminal is exposed. An inner lead 5 is then connected through a bonding wire 2 with the external terminal 9. A support bar 7 is shaped such that the semiconductor chip 1 and the die pad 3 are positioned at the central part in the thickness direction of a space defined by a package metal mold and then the support bar 7 is set up. This constitution eliminates floating or sinking of the semiconductor chip 1 and the die pad 3 by feeding resin uniformly to the semiconductor chip 1 side and the die pad 3 side. |
