FORMATION OF BUMP FOR INTEGRATED CIRCUIT

摘要

PURPOSE:To allow formation of smaller bumps by bonding a wire onto pads through wedge bonding and then cutting off the wire at the neck part thereof. CONSTITUTION:A wire 32 is bonded through wedge bonding onto a pad 22 formed on an integrated circuit 20 and then the wire 32 is cut off at the neck part 32a thereof. Wedge bonding onto the pad 22 may be first bonding or second bonding. Since ball is not formed but the wire 32 is collapsed directly by means of a wedge, size of the bump 32b can be controlled freely by the width W and the length L at the tip of the wedge. This method allows formation of a bump 32b having smaller dimensions as compared with conventional ball bonding.