| 摘要 |
<p>PURPOSE:To provide a multi-layer printed wiring board manufactured with no through hole plating method. CONSTITUTION:Inside/outside layer printed wiring boards 1, 4 and 6 are, while aligned, bonded together to form a multi-layer printed wiring board 15, and at the same time, into through holes 12, 13 and 14 of connection lands 8, 9, 10 and 11 of printed wiring circuits 2, 3, 5, and 7 of the printed wiring boards 1, 4 and 6, a lead 25 consisting of multiple thin wires 16 of an electronic parts 23 is inserted and set. By utilizing capillarity of the lead 25 consisting of multiple thin wires 16, the through holes 12, 13 and 14 are filled with melted solder 17, for hardening, with the result that the printed wiring circuits 2, 3, 5 and 7 are mutually electrically connected. Thus, the multi-layer printed wiring board 15 containing the printed wiring circuits 2, 3, 5 and 7, the first through fourth layers, is configured.</p> |
