发明名称 COMPOUND SEMICONDUCTOR SUBSTRATE AND ITS MANUFACTURE
摘要 PURPOSE:To obtain a compound semiconductor substrate containing In and P suited to the formation of a quantum fine line construction by providing {100} principal planes as step upper planes and forming molecular layer steps having predetermined smoothness and step front side planes in a stepped form with a periodicity within a predetermined range in [011] direction. CONSTITUTION:A material substrate 1 comprising InP is prepared, which is mechanically processed in such a manner that the plane sloped only by 1 deg. from (100) plane to <011> direction can become the reference plane. On this reference plane, InP, InGaAs or InGaAsP is subjected to crystal growth, and a buffer layer 2 is formed. By doing this, molecular layer steps having (100) planes as step upper planes for principal planes and step front side planes with predetermined smoothness can be formed in a stepped form having a periodicity within a predetermined range in <011> direction can be formed. In this way, a barrier layer 3 consisting of InP, a quantum well layer 5 consisting of InGaAs and a barrier layer 6 consisting of InP are sequentially formed on the buffer layer 2. By doing this, quantum fine line can be obtained on the substrate.
申请公布号 JPH0697072(A) 申请公布日期 1994.04.08
申请号 JP19920244948 申请日期 1992.09.14
申请人 HIKARI GIJUTSU KENKYU KAIHATSU KK;FUJITSU LTD 发明人 FUJII TAKUYA;SUGAWARA MITSURU
分类号 H01L21/20;H01L21/203;H01L21/205;H01L29/06;(IPC1-7):H01L21/20 主分类号 H01L21/20
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