| 摘要 |
PURPOSE:To realize an electromagnetic shield structure between electronic circuits which makes electromagnetic shield possible between electronic circuits of 2- and 3-dimensional structures adapted to high density mounting and can be adapted to design modification flexibly. CONSTITUTION:A receiving circuit 8 adjacent to a transmitting circuit 7 is mounted on a printed substrate 5, and an electromagnetic shield film 1 is mounted between the both circuits 7, 8 for preventing coupling between the both. The electromagnetic shield film 1 is formed by insulating and coating a 18 to 35mum-thick conductive layer 3 consisting of a good conductive conductor such as copper covered with an insulation layer 4 consisting of polyimide, polyester, etc., of several tens of microns. The electromagnetic shield film 1 is connected to a ground plane 6 of the printed substrate 5 through a through-hole 11 by solder by a connection lead 2 provided to one side of the conductive layer 3. A terminal pitch of the connection lead 2 is made at most one-fourth of the wavelength of a frequency to be used; thereby, satisfactory shield effect can be acquired. |
