SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To improve the heat radiability of a resin-sealed type LSI package without moisture resistance lowered. CONSTITUTION:This device is a resin-sealed type LSI package 1 in which a through-hole 7 is provided in the rear of a die pad 6 on which a semiconductor chip 5 is mounted, and the through-hole 7 is filled up with liquid or gel heat radiating materials, and at the same time a heat radiator 3 is bonded in the bottom of the body 2 of the package.