| 摘要 |
PURPOSE:To remove photoresist from the peripheral portion of a wafer for preventing photoresist from peeling-off and turning into suspended dust which may contaminate the wafer or equipment when fixing or conveying the wafer within equipment for giving a treatment to the wafer for semiconductor device. CONSTITUTION:A chip pattern 11 for semiconductor device is arranged for a portion corresponding to a central portion 3 of a wafer 1 of a light exposure photomask 10 of a photoresist film applied to the wafer 1, and a mark pattern 12 for mask matching is formed by pushing in the array. Also, a portion corresponding to a peripheral portion 4 of the wafer 1 is formed to an unpattern portion with a clear ground or a black ground, the photoresist film exposed to light by the photomask 10 is certainly removed from the peripheral portion 4 of the wafer 1 during development, and a possibility of peeling-off off of the resin of the photoresist as a result of the contact of a presser jig 30 to the peripheral portion 4 when fixing the wafer 1 within a treatment equipment can be completely eliminated. |
