| 摘要 |
<p>PURPOSE:To provide a resin sealed semiconductor device having enhanced heat dissipation properties and decreased width of sealing resin in which the need of insulating film for securing leads and highly heat resistant adhesive is eliminated while making thin the sealing resin and lowering impedances of signal path and power supply path. CONSTITUTION:A lead frame is disposed such that the joints to inner lead 6 and outer lead 4 are positioned, while spaced apart from each other, above a semiconductor chip 1 and the inner lead 6 is bonded, at the tip thereof, directly to an electrode 2 of the semiconductor chip 1.</p> |
