| 摘要 |
<p>PURPOSE:To produce the laminated substrate by which the conductive connection between substrates by conductive adhesives is surely obtd. with high accuracy. CONSTITUTION:This process for production includes a stage 100 for spotting the first adhesive (conductive adhesive) to the prescribed region of the first substrate, a stage 200 for applying the second adhesive after drying the first adhesive to the touch, a stage 300 for installing a masking layer for forming the masking layer in the part of the first substrate where the adhesive is not required, a stage 400 for sticking the second substrate to cover the first adhesive and the second adhesive and a stage 500 for removing the masking layer together with the excessive adhesive. As a result, the substrates are surely and conductively connected to each other without compatibilizing of the first adhesive and the second adhesive.</p> |
