| 摘要 |
<p>PURPOSE:To provide a frame for arraying electronic components that can be made common to as many array structures as possible irrespective of the type and the number of electronic components to be mounted and the way of wiring. CONSTITUTION:Pads 10a-15a of pairs of opposite islands 10-15 are unified into a square shape having the same size. Diodes 21, 22 and 23 are die-bonded to pads 10a, 12a and 14a of the islands 10, 12 and 14, respectively. The diodes 21, 22 and 23 are wire-bonded to islands 11, 13 and 15 by Au wires 31, 32 and 33, respectively. All of the pads are sealed with a resin mold 40.</p> |
