| 摘要 |
<p>PURPOSE:To improve the propagating speed of signals in an interconnection part and to obtain a circuit board having a high heat conductivity. CONSTITUTION:The circuit board is provided with an insulating layer 3 consisting of a highly heat conductive material consisting of at least one kind selected from aluminum nitride, boron nitride, boron carbide, diamond-like carbon and diamond, interconnection parts 41, 42... 4n-1 buried in the insulating layer 3, and a dielectric film 5 which is formed around the interconnection parts 41, 42... 4n-1 and consists of a low-permittivity material of at least one selected from amorphous aluminum nitride, amorphous silicon oxide, silicon oxide and borosilicate glass.</p> |
