METHOD AND APPARATUS FOR MANUFACTURE OF CHIP SET

摘要

PURPOSE: To provide a chip set manufacturing device with which a desired serviceability can be accomplished using a suitable number of wafers, and to provide the method of manufacturing the above-mentioned device. CONSTITUTION: The method and device for formation of a semiconductor job are provided to attain a desired level of set serviceability using the minimum number of wafers. When control conditions are satisfied, the problem of configuration is formulated by mathematical optimization which is known that it is different to dispose of it mathematically. Mathematical optimization reformation 120 is mathematically optimized (126) in a job configuration 110, and the condition of restriction in efficiency measuring is replaced with the lower limit which is easily disposed of mathematically. The lower limit (against P1) is set in such a manner that it exceeds a desired serviceability level or exceeds the chip set of a required number (against P2). As a result, the desired serviceability can be obtained with certainty against the original problem when the reformulated solution is required.