| 摘要 |
PURPOSE: To provide a conductive bonding technique which aligns the narrow region bonding pads of an integrated circuit with the bonding pads of a board. CONSTITUTION: A matrix array of ferromagnetic elements 25' insulated from each other is formed. The ferromagnetic elements 25' are magnetized, and a single layer of conductive ferromagnetic piece 33 is bonded to the upsides of the ferromagnetic elements 25'. The conductive piece layer is brought into contact with an adhesive polymer and penetrates the polymer. The adhesive polymer is cured and encloses the conductive piece layer in it. The cured adhesive polymer is removed and arranged between a first and a second conductive array, 40 and 43. Thereafter, the adhesive polymer is softened by heating, pressed between the conductive arrays 40 and 43, bonded to the conductive arrays 40 and 43 to connect them together, and then cured to join the conductive arrays 40 and 43 together into an integral structure. |
