| 摘要 |
PURPOSE:To speedily cope with the generation of a defective product by a method wherein, when a wire bonding operation is conducted for connection of a lead and the electrode formed on a semiconductor element, the lead is pressed by a frame presser, and at the same time, an inner lead is inscribed. CONSTITUTION:The semiconductor element 6, which is attached to the tab of a lead frame 3, is conveyed to a heat block 9. The lead frame 3 is positioned, the lead frame is fixed by pressing by a lead frame presser 1 from above the upper surface of the lead frame 3. At this time, a needle 5 is attached to the desired attaching hole 4, and a marking, which shows that manufacture is conducted, is provided on the lead 3. The mounting hole 4 of the marking needle 5 is changed by a wire bonding device, and the lead to be marked is also changed. As a result, the leads processed by a plurality of wire bonding devices can be classified by the marking provided on the leads. |
