| 摘要 |
PURPOSE:To improve the through put of wire bonding by providing a plurality of tool shifting devices. CONSTITUTION:This is a wire bonding device with which a gold wire is bonded between chips 7 and lead frames 6 by shifting a bonding tool 1 having a capillary 2 provided on the tip, in X-, Y- and Z-directions. A plurality of tables 4a and 4b are provided on a 2-dimensional movement mechanism 4 with which the bonding tool 1 is shifted to X-and Y-directions. The tables can be moved independently, they can be moved in the same direction, or each of them can be moved in different direction. The tables can be operated at high speed and they can be controlled in a precise manner. |
