| 摘要 |
PURPOSE:To simplify production process of board for mounting electronic components having stadium structure in which strength is enhanced at the joint of lead in case of fine pitch lead while increasing the distance between the bonded parts of adjacent leads. CONSTITUTION:A lower board 2 formed with an electronic component mounting part is bonded through adhesive 9 with an upper board 3 having smaller size. A conductor pattern 11a to be connected with a lead 4a is formed on the top surface of the lower board 2. A conductor pattern 13a to be connected with electronic components is formed on the top surface of the upper board 3 while a conductor pattern 13c to be connected with a lead 4b is formed on the bottom surface thereof with both conductor patterns being connected through a through hole 14. Joints of the leads 4a, 4b are arranged in zigzag. The lead 4b connected with the conductor pattern 13c is held between both boards 2, 3 through the adhesive 9. |
