HIGH-DENSITY IC PACKAGE AND MANUFACTURE THEREOF

摘要

PURPOSE:To lower the production cost by unifying the pad forming process and the equipment therefor regardless of the item number. CONSTITUTION:In the one which has at leased a power supply wiring or ground wiring and a signal wiring formed therein, and which includes a die-attaching portion for mounting an IC and a terminal resistance 31a, a high-density IC package 1 wherein a power supply or ground pad 32a connected to any of the power supply wiring or the ground wiring, a signal pad 32b connected to the signal wiring, and a resistance pad 32C connected to the terminal-resistance 31a are arranged in the form of three ranks around the die-attaching portion.