| 摘要 |
Substrates comprising an aluminium base, an insulant consisting of a film of alumina obtained by anodising the said base on at least one of its faces and at least one metal film intended to be converted by chemical etching into a network of conductors, characterised in that the said film of alumina consists of a uniform compact zone, adhering to the aluminium, which has a thickness of more than 500 nm and of a porous layer with a rough outer surface. …<??>The process enabling such substrates to be obtained is characterised in that the base is subjected on at least one of its faces to a treatment in a porous anodising bath and then in a so-called "barrier" anodising bath. …<??>This invention finds its application in the production of substrates for one-sided and two-sided interconnecting circuits with metallised holes, multilayer conductive circuits, the said substrates having planar or spatial configuration, and of resistive networks. |
