DESIGNING METHOD AND PRODUCTION OF NONORGANIC MULTILAYERED WIRING BOARD

摘要

PURPOSE:To provide a designing method for nonorganic multilayered wiring board where the connection of via hole between first and second layers is highly reliable. CONSTITUTION:The dimension of via receiving land 16 formed on a via hole 15 of a first-layer green sheet 11 and around the hole 15 is arranged to become larger than those of the via receiving lands 16 of second-layer or higher green sheets 12, 13 and 14 on the basis of the shrinkage amount difference between the first-layer and the second-layer or higher green sheets 12, 13 and 14 that is generated during production process.