Keramisches Verbindungssubstrat und Verfahren zu seiner Herstellung.
摘要
A ceramic wiring substrate has at least one layer of a signal line pattern, a ground electrode pattern layer, and a cavity formed by a region which covers part of or completely the signal line pattern inside ceramic between the signal line pattern and the ground electrode pattern.
申请公布号
DE3788442(T2)
申请公布日期
1994.04.07
申请号
DE19873788442T
申请日期
1987.02.12
申请人
NEC CORP., TOKIO/TOKYO, JP
发明人
IKEDA, TERUYUKI, MINATO-KU TOKYO, JP;UTSUMI, KAZUAKI, MINATO-KU TOKYO, JP
