Semiconductor modular structure prodn. - by convexly shaping and bonding in single hot pressing operation

摘要

Semiconductor bodies are bonded to the metallisation of a metallised ceramic substrate bonded to a metallic base plate. The base plate is convexly shaped by a press ram. The semiconductor bodies (4), the ceramic substrate (2) and the base plate (1) are placed in an elastomeric pressing mould (5). A heated press ram (7) with a concave surface is positioned on the base plate. At least the base plate (1) and the substrate (2) are deformed and bonded at an elevated temp. by the pressure of the ram (7). Pref., metal layers are provided between the semiconductor bodies (4), the metallisation (3) and the base plate (1) to cause bonding of these parts by pressure sintering or diffusion welding. Alternatively, the semiconductor bodies (4), the metallisation (3) and the base plate (1) are soldered before placing in the mould (5) and deformation is carried out at below the melting temp. of the solder. ADVANTAGE - Convex shaping effected in single operation.