Halogen containing epoxy resin composition and copper-clad laminate.

摘要

An epoxy resin composition excellent in heat resistance and low in dielectric and a copper-clad laminate obtained by molding it are disclosed. The epoxy resin composition of the invention comprises: (1) a compound obtainable by previously reacting (A) an epoxy resin obtainable by glycidyl etherifying a 3-methyl-6-(C4-C8)alkylphenol novolak with (B) a halogen-containing bisphenol compound represented by the following formula (1): <CHEM> wherein R1 represents a hydrogen atom or a methyl group and the two R1 may be identical or different, X and X' represent halogen atom and may be identical or different, and i and j independently of one another are integers of 1 to 4, or a compound obtainable by previously reacting (A) the above epoxy resin, (B) the above halogen-containing bisphenol compound and (C) a glycidyl etherification product of a halogen-containing bisphenol compound which is represented by the following formula (2): <CHEM> wherein R2 represents a hydrogen atom or a methyl group and the two R2 may be identical or different, Y and Y' represent halogen atom and may be identical or different, n represents an average recurring unit number and is 0 to 10 and k and l independently of one another are integers of 1 to 4, and (2) an epoxy hardener.