发明名称 |
DEVICE AND METHOD FOR SEALING ELECTRONIC PARTS AND CARRIER ASSEMBLY |
摘要 |
PURPOSE: To prevent the blow-out by operatively coupling a second platen to a first platen and setting the iso-thermal condition for a package and a lid by both platens when the first and second platens are placed in a sealing position. CONSTITUTION: An apparatus 1 comprises two main sections formed by a first platen 2 and a second platen 3. A hinge plate 20a of the first platen 2 and a hinge plate 20b of the second platen 3 are mutually operatively coupled by means of a hinge pin 20c. The second platen 3 is moved about a rotary axis by the hinge means. This rotating motion correctly aligns the first platen 2 and the second platen 3 to a sealing position of a platen alignment pin 9a and a corresponding hole 9b capable of receiving the pin. Whereby the package 5 and a mounting surface of the lid 8 can be automatically aligned, and the iso-thermal sealing can be ensured. |
申请公布号 |
JPH0692316(A) |
申请公布日期 |
1994.04.05 |
申请号 |
JP19910091442 |
申请日期 |
1991.03.29 |
申请人 |
R J R POLYMER-ZU INC |
发明人 |
RICHIYAADO JIEI ROSU;JIERII II KIYANBERU |
分类号 |
B65B15/04;B29C65/00;B29C65/02;B29C65/48;B29C65/78;B65B7/28;H01L21/00;(IPC1-7):B65B15/04 |
主分类号 |
B65B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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