发明名称 DEVICE AND METHOD FOR SEALING ELECTRONIC PARTS AND CARRIER ASSEMBLY
摘要 PURPOSE: To prevent the blow-out by operatively coupling a second platen to a first platen and setting the iso-thermal condition for a package and a lid by both platens when the first and second platens are placed in a sealing position. CONSTITUTION: An apparatus 1 comprises two main sections formed by a first platen 2 and a second platen 3. A hinge plate 20a of the first platen 2 and a hinge plate 20b of the second platen 3 are mutually operatively coupled by means of a hinge pin 20c. The second platen 3 is moved about a rotary axis by the hinge means. This rotating motion correctly aligns the first platen 2 and the second platen 3 to a sealing position of a platen alignment pin 9a and a corresponding hole 9b capable of receiving the pin. Whereby the package 5 and a mounting surface of the lid 8 can be automatically aligned, and the iso-thermal sealing can be ensured.
申请公布号 JPH0692316(A) 申请公布日期 1994.04.05
申请号 JP19910091442 申请日期 1991.03.29
申请人 R J R POLYMER-ZU INC 发明人 RICHIYAADO JIEI ROSU;JIERII II KIYANBERU
分类号 B65B15/04;B29C65/00;B29C65/02;B29C65/48;B29C65/78;B65B7/28;H01L21/00;(IPC1-7):B65B15/04 主分类号 B65B15/04
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