发明名称 LIQUID RESIST INK COMPOSITION AND PRINTED CIRCUIT BOARD
摘要 PURPOSE:To obtain a composition capable of developing with a diluted alkali water solution, excellent in resolving property, solvent resistance and plating resistance and useful for printed circuit boards, etc., by including a specific ultraviolet ray-curable resin, a photopolymerization initiator, a diluent, ammonia, etc., a thermosetting epoxy compound and water. CONSTITUTION:The composition contains (A) an ultraviolet ray curable resin obtained by reacting a reactional product of an epoxy resin and an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride, (B) preferably 1-25 pts.wt. (based on 100 pts.wt. component A) photopolymerization initiator such as benzoin, (C) preferably 10-95wt.% (based on total amount of the composition) diluent such as ethanol, (D) preferably 0.5-1.1 chemical equivalent (based on total amount of carboxyl group in the composition) of ammonia and/or amines such as 2-dimethylaminoethanol, (E) a thermosetting epoxy compound and (F) preferably 4-95wt.% (based on total amount of the composition) water.
申请公布号 JPH0693221(A) 申请公布日期 1994.04.05
申请号 JP19920266617 申请日期 1992.09.09
申请人 GOOU KAGAKU KOGYO KK 发明人 HASHIMOTO SOICHI;MIYAYAMA SATOSHI;MIYAKE TOKUZAN
分类号 C08F2/44;C08F290/00;C08F299/02;C08G59/40;C09D11/10;G03F7/027;H05K3/00;(IPC1-7):C09D11/10 主分类号 C08F2/44
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