发明名称 PLATE MATERIAL WORK DEVICE
摘要 PURPOSE:To enable automation of polishing for the peripheral edges of plate material, highly efficient polishing, and reduction in production cost. CONSTITUTION:A work is fixed on a work table 10, both first and second polishing units 100 and 200 are moved along the side edge of the work table 10, and thus the two side edges of the work are polished. In this case, the work dimensions are inputted into a control device 400 by an operator and the positions of the polishing units 100 and 200 are detected by a position detection means beforehand, and thus the control device 400 moves the polishing units 100 and 200 with rapid traverse in the area not corresponding to the work, and moves at a specified polishing speed in the area corresponding to the work.
申请公布号 JPH0691526(A) 申请公布日期 1994.04.05
申请号 JP19920271069 申请日期 1992.09.14
申请人 AMITEC CORP 发明人 HAMASHIMA YOSHIHIKO;UCHIKAWA SEIJI;NODA YOICHI
分类号 B24B9/00;B24B21/00;B24B47/20;B24B51/00;(IPC1-7):B24B47/20 主分类号 B24B9/00
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