摘要 |
PURPOSE:To pressurize a member to be polished evenly on a grinding pad by evenly distributing pressure applied on the member to be polished, and facilitate the removal of the member to be polished after polishing. CONSTITUTION:A top ring 6 is connected to a polishing head 1 of which outer periphery is protruded downward, a diaphragm 8 to which a tension is given by a tension ring (tension means) 11 is fixed to the connected part, and a wafer (member to be polished) 16 which is held on a polishing plate 13 located on the lower surface of the diaphragm 8 is pressurized to a polishing pad 15 side. Also a fluid pressure to pressurize a pressurizing chamber 9 is made variable, and the grinding head 1, top ring 6, and diaphragm 8 are enabled integrally to be lifted. |