发明名称 POLISHING DEVICE
摘要 PURPOSE:To pressurize a member to be polished evenly on a grinding pad by evenly distributing pressure applied on the member to be polished, and facilitate the removal of the member to be polished after polishing. CONSTITUTION:A top ring 6 is connected to a polishing head 1 of which outer periphery is protruded downward, a diaphragm 8 to which a tension is given by a tension ring (tension means) 11 is fixed to the connected part, and a wafer (member to be polished) 16 which is held on a polishing plate 13 located on the lower surface of the diaphragm 8 is pressurized to a polishing pad 15 side. Also a fluid pressure to pressurize a pressurizing chamber 9 is made variable, and the grinding head 1, top ring 6, and diaphragm 8 are enabled integrally to be lifted.
申请公布号 JPH0691522(A) 申请公布日期 1994.04.05
申请号 JP19920240350 申请日期 1992.09.09
申请人 HITACHI LTD 发明人 YUI HAJIME;MATSUZAKI TORU
分类号 B24B37/005;B24B37/04;B24B37/30;H01L21/304 主分类号 B24B37/005
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