Photopolymerizable resin material and process for preparing print circuit using the material

摘要

The photopolymerizable resin material of the present invention includes (1) a support, (2) a water soluble intermediate layer of 0.1 to 50 (my)m in thickness superposed on the support and (3) a photopolymerizable resin layer superposed on the intermediate layer which contains at least one carboxyl group-containing binder in an amount of from 40 to 90% by weight based on the solid content in the photopolymerizable resin layer, wherein the intermediate layer includes a cellulose derivative which has a polymerization degree of from 20 to 1,000 and is selected from the group consisting of an aqueous alkali solution soluble hydroxyalkyl cellulose, carboxyalkyl cellulose and cellulose ether. The present invention is also directed to a process for preparing a printed circuit which includes laminating the photopolymerizable material on a board, peeling off the support and then effecting pattern exposure and development.