发明名称 Method and device for treating substrates
摘要 The invention relates to a device for coating substrates by sputtering out of a plasma with at least one anode, one cathode, and an electric dc current voltage source, connectable pulse-wise to the anode/cathode path. The length of the voltage pulses and/or the interval between the pulses is regulatable.
申请公布号 US5300205(A) 申请公布日期 1994.04.05
申请号 US19930032420 申请日期 1993.03.16
申请人 LEYBOLD AKTIENGESELLSCHAFT 发明人 FRITSCHE, WOLF-ECKART
分类号 C23C14/34;C23C14/54;H01J37/34;(IPC1-7):C23C14/54;C23C14/56 主分类号 C23C14/34
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