发明名称 MOLDING DEVICE OF POLYMERIC MATERIAL
摘要 PURPOSE:To provide a device molding a polymeric material, especially, a thermosetting resin within an extremely short time while the generation of a flaw therein is prevented. CONSTITUTION:A coil conductor 2 is set to the interior of a mold 1 and the periphery of the coil conductor 2 is filled with a molding resin 3 to be heated, cured and molded. In this constitution, a deformable thin plate 4 having proper rigidity is airtightly attached to the inner surface of the mold and pressure from a pressure port 6 is changed so as to follow the curing development of the resin to control the deformation of the thin plate and the generation of a flaw caused by the volumetric contraction of the resin is prevented.
申请公布号 JPH0691676(A) 申请公布日期 1994.04.05
申请号 JP19920241673 申请日期 1992.09.10
申请人 HITACHI LTD 发明人 FUKUSHI YOSHISHIGE;FUJIOKA SHINEI;KOYAMA TORU;TAKASAKI HIROKAZU;KANO YASUSHI
分类号 B29C39/10;B29C39/26;B29C39/44;B29K63/00;B29L31/34;(IPC1-7):B29C39/26 主分类号 B29C39/10
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