发明名称 Process for forming a positive pattern through deep ultraviolet exposure, heat treatment and development with TMAH solution containing an alcohol to improve adhesion
摘要 A pattern with good adhesiveness to a substrate and good shape and heat resistance can be formed by coating a pattern forming material comprising (a) a resin, (b) a photoacid generator and (c) a solvent on the substrate, exposing to deep UV light, and developing using a mixed solvent of tetramethylammonium hydroxide and an alcohol.
申请公布号 US5300404(A) 申请公布日期 1994.04.05
申请号 US19920864131 申请日期 1992.04.06
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TANI, YOSHIYUKI;SASAGO, MASARU
分类号 G03F7/32;G03F7/004;G03F7/039;H01L21/027;H01L21/30;(IPC1-7):G03F7/30 主分类号 G03F7/32
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