| 摘要 |
A method for severing integrated-circuit conductive links by laser power employs a phase plate (26) to shape the laser beam's intensity profile. The profile thus imparted to the beam approximates the Fourier transform of the intensity profile desired on the workpiece (34). As a consequence, when a focusing lens (32) receives a beam having the profile imparted by the phase plate (26), it focuses that beam into a spot on the workpiece (34) having an intensity profile more desirable than the ordinary Gaussian laser-beam profile.
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