| 发明名称 |
DIELECTRIC VIAS WITHIN MULTI-LAYER 3-DIMENSIONAL STRUCTURAL/SUBSTRATES |
| 摘要 |
2124197 9407348 PCTABS00031 An array of dielectric vias formed in the insulating layers of a unitized multilayer circuit structure wherein the dielectric vias have a dielectric constant different from the dielectric constant of the insulating layers in which they are formed. |
| 申请公布号 |
CA2124197(A1) |
申请公布日期 |
1994.03.31 |
| 申请号 |
CA19932124197 |
申请日期 |
1993.09.23 |
| 申请人 |
|
发明人 |
MCCLANAHAN, ROBERT F.;WASHBURN, ROBERT D. |
| 分类号 |
H01L23/498;H01L23/538;H05K1/00;H05K1/02;H05K1/03;H05K1/09;H05K1/16;(IPC1-7):H05K1/02 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
