发明名称 |
Thermosetting resin compositions |
摘要 |
A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.
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申请公布号 |
US5300588(A) |
申请公布日期 |
1994.04.05 |
申请号 |
US19920863271 |
申请日期 |
1992.04.03 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SHIOBARA, TOSHIO;TOMIYOSHI, KAZUTOSHI;SHIMIZU, HISASHI;MARUMI, MANABU |
分类号 |
C08L79/08;C08L83/10;(IPC1-7):C08L63/04;C08L63/10 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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