发明名称 |
PLASTIC SEMICONDUCTOR PACKAGE WITH ALUMINUM HEAT SPREADER |
摘要 |
There is provided a molded plastic electronic package (40) having improved thermal dissipation. A heat spreader (26), formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin (30). Forming a black anodization layer (42) on the surface of the heat spreader (26) improves both thermal dissipation and adhesion to the molding resin. |
申请公布号 |
WO9407263(A1) |
申请公布日期 |
1994.03.31 |
申请号 |
WO1993US08215 |
申请日期 |
1993.09.02 |
申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK;BRADEN, JEFFREY, S.;CHEN, SZUCHAIN, F. |
分类号 |
H01L23/28;H01L23/31;H01L23/373;H01L23/433 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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