发明名称 Circuit board layout for high data rate coupling field - has parallel connections for two SMDs on opposite sides of circuit board provided by vias
摘要 The circuit board layout-using a number of surface mounted devices and through contacts between the circuit board paths on opposite sides of the circuit board- has a number of connections for two such SMDs connected in parallel with further connections for each of these SMDs and others connected in series. Up to six SMDs (KE1....KE6) are arranged with their parallel connections symmetrical to a mirror axis (SPA) along the upper and lower surfaces of the circuit board so that the parallel connections of two devices lie directly above one another for connection via the trough contacts, with further devices directly adjacent one another to allow the series connections. ADVANTAGE - Reduced space and power required by having no lead drives and low resistance input terminals for leads increasing reliability of complete circuit.
申请公布号 DE4232267(A1) 申请公布日期 1994.03.31
申请号 DE19924232267 申请日期 1992.09.25
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 SCHINAGEL, DIETER, DIPL.-ING., 8000 MUENCHEN, DE;TREYER, THOMAS, DIPL.-ING., 8000 MUENCHEN, DE
分类号 H04Q3/52;H04Q11/04;H05K1/02;H05K1/18;(IPC1-7):H05K1/18;H05K3/46;H01L23/50 主分类号 H04Q3/52
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