| 摘要 |
In a process for soldering partial areas (5) of a metallic structure (2, 4), a sticky material is applied on the partial areas (5) and then soldering powder is applied thereon, which adheres to the sticky material. The sticky material retains its stickiness up to temperatures of at least 180 , preferably above 200 C, so that when the structure (2, 4) is thermally treated, in particular thermally degreased, no soldering powder is lost. This process is particularly suitable to produce catalyst carrier bodies (1) for catalytic converters of internal combustion engines, since during its production two different connections have to be achieved, i.e. binding the honeycombed body itself (4) to a tubular casing (2) and assembling individual sheet metal layers of the honeycombed structure (4). Different soldering techniques can be successively applied with no loss of the initially applied soldering powder. |
