| 摘要 |
A cooling structure which is used for forced cooling of an electronic circuit package is disclosed. The cooling structure comprises a bottom heat radiation plate (7) on which the electronic circuit package is mounted, a nozzle (10) for jetting coolant toward the bottom heat radiation plate, a first vertical heat radiation plate (8) mounted on the bottom heat radiation plate (7) and disposed so as to surround the nozzle (10), openings (12) formed in the first vertical heat radiation plate (8) for again jetting coolant jetted from the nozzle (10); and a second vertical heat radiation plate (9) mounted on the bottom heat radiation plate (7) and disposed so as to surround the first vertical heat radiation plate (8) at least in an opposing relationship to the openings. The coolant jetted from the openings (12) collides with and removes heat from the second vertical heat radiation plate (9). <IMAGE> |
