Electronic appts. using power semiconductors - provides respective cooling medium flow jets for each power semiconductor heat sink element

摘要

The electronic device provides a heat sink element (22) for each power semiconductor (21) having surface cooling ribs, lying in a cooling flow stream provided by associated jets (23), the flow direction (27) being the same for all the heat sink elements. The cooling flow jet lies on the opposite side of each heat sink element to the power semiconductor with a flow space for the cooling medium between the adjacent jets, extending in a direction perpendicular to the cooling medium flow direction and the flow medium ejection direction. ADVANTAGE - Effective cooling of closely packed power semiconductors in single plane or reduces flow resistance along cooling path to improve cooling and reduce noise level at same time.