| 发明名称 |
DIELECTRIC VIAS WITHIN MULTILAYER 3-DIMENSIONAL STRUCTURES/SUBSTRATES |
| 摘要 |
An array of dielectric vias formed in the insulating layers of a unitized multilayer circuit structure wherein the dielectric vias have a dielectric constant different from the dielectric constant of the insulating layers in which they are formed. |
| 申请公布号 |
WO9407348(A1) |
申请公布日期 |
1994.03.31 |
| 申请号 |
WO1993US08930 |
申请日期 |
1993.09.23 |
| 申请人 |
HUGHES AIRCRAFT COMPANY |
发明人 |
MCCLANAHAN, ROBERT, F.;WASHBURN, ROBERT, D. |
| 分类号 |
H01L23/498;H01L23/538;H05K1/00;H05K1/02;H05K1/03;H05K1/09;H05K1/16 |
主分类号 |
H01L23/498 |
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