| 摘要 |
<p>Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, <CHEM> wherein R1-R8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, <CHEM> wherein R1-R8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R9 is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, <CHEM> wherein R is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, (C) an inorganic filler, and (D) a hardening accelerator. <C</p> |
