SUBSTRATE PACKAGING SYSTEM AND ELECTRONIC SYSTEM PACKAGING SYSTEM

摘要

PURPOSE:To provide a substrate packaging system with an expandibility in two-dimensional and three-dimensional directions by connecting systems consisting of a number of parts closely. CONSTITUTION:A main substrate 5 is fixed to a power supply bar 1 and a horizontal connection substrate 4 is stack-connected so that two main substrates which are adjacent in horizontal direction are crossed for constituting a two-dimensional module and a vertical connection substrate 7 is erected vertically on the surface of each main substrate 5 and the main substrate 5 is piled up above it for constituting a two-dimensional module, thus achieving a flexible expandibility in a three-dimensional direction and connecting the parts of a large-scale electronic equipment with a number of wirings with improved frequency characteristics and a high reliability.