发明名称 INTER-IC CIRCUIT CONNECTING METHOD
摘要 PURPOSE:To establish a method of connecting simply and certainly an electronic circuit board which is split for miniaturization. CONSTITUTION:When IC circuits 8 mounted on a wiring board 9 are to be connected, the connecting electrode portion 16 at each end of a connection plate 12 where connection wiring patterns 15 are formed on the surface, is connected to a lead terminal 10 of each IC circuit 8 through a solderless connector 11.
申请公布号 JPH0689753(A) 申请公布日期 1994.03.29
申请号 JP19920265312 申请日期 1992.09.08
申请人 DAINI SHINANO POLYMER KK;SHIN ETSU POLYMER CO LTD 发明人 OGAWA NOBUYOSHI
分类号 H01L23/538;H01R11/01;H05K1/18;H05K3/32 主分类号 H01L23/538
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