发明名称 |
INTER-IC CIRCUIT CONNECTING METHOD |
摘要 |
PURPOSE:To establish a method of connecting simply and certainly an electronic circuit board which is split for miniaturization. CONSTITUTION:When IC circuits 8 mounted on a wiring board 9 are to be connected, the connecting electrode portion 16 at each end of a connection plate 12 where connection wiring patterns 15 are formed on the surface, is connected to a lead terminal 10 of each IC circuit 8 through a solderless connector 11. |
申请公布号 |
JPH0689753(A) |
申请公布日期 |
1994.03.29 |
申请号 |
JP19920265312 |
申请日期 |
1992.09.08 |
申请人 |
DAINI SHINANO POLYMER KK;SHIN ETSU POLYMER CO LTD |
发明人 |
OGAWA NOBUYOSHI |
分类号 |
H01L23/538;H01R11/01;H05K1/18;H05K3/32 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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